SMP-03 Case
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
Case Dimensions
Dimension
Min
A
B
C
D
E
H
J
K
P
6.80
4.80
mm
Nom
7.00
5.00
1.65
0.60
2.54
1.0
5.00
3.00
1.27
Inches
Max
7.20
5.20
2.00
Min
0.268
0.189
Nom
0.276
0.197
0.065
0.024
0.100
0.039
0.197
0.118
0.050
Max
0.283
0.205
0.079
Recommended PCB Footprint
Electrical Connections
Connection
Port 1
Port 2
Input or Return
Return or Input
Output or Return
Return or Output
Ground
Single Ended Operation
Differential Operation
Terminals
10
1
5
6
All others
Return is ground
Return is hot
Materials
Solder Pad
Termination
Lid
Body
Pb Free
Au plating 30 - 60 uInches (76.2-152 uM) over 80-200
uInches (203-508 uM) Ni.
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 uInches Thick
Al
2
O
3
Ceramic
www.RFM.com
E-mail: info@rfm.com
©2008 by RF Monolithics, Inc.
Page 3 of 3
SF1131B - 3/28/08
RFM [ RF MONOLITHICS, INC ]
