Electrical Connections
Footprint
Actual size footprint:
1
8
7
6
5
Terminal
Number
1
2
3
4
5
6
7
8
LID
Connection
V
CC
Ground
NC or Ground
Q Output
Q Output
Ground
ENABLE
Ground
2
3
4
TOP VIEW
Typical Printed Circuit Board Land Pattern
A typical land pattern for a circuit board is shown below. Grounding of the
metallic center pad is optional.
Case Design
All pads consist of 30 microinches (min) electroless gold on 50 microinches
(min) electroless nickel over base metal. The metallic center pad was
designed for mechanical support. Grounding of this pad is optional.
Lid symbolization, including terminal 1 locator dot, are in contrasting ink.
Symbolization varies by model number. For purposes of illustration, only
terminal 1 dot is shown.
B
D
Typically 0.01" to 0.05" or 0.25 mm to
1.25 mm (8 Places)
(The optimum value of this dimension is
dependent on the PCB assembly process
employed.)
.
Typical Test Circuit
V
cc
0.1
μ
F
Sine-Wave
Signal Generator
C
E
N
(X8)
A
F
(X8)
4.7
μ
H
M
G
L
(X3)
V
cc
H
(X2)
50
Ω
Q
50
Ω
Q
*
Tektronix
CSA 803
Digitizing
Oscilloscope
Ch 1
Trigger
Ch 2
Clock
Under Test
ENABLE
*
K
J
50
Ω
*Power Splitter, Mini-Circuits ZFSC2-4
Timing Definitions
Millimeters
Min
Max
13.46
9.14
13.97
9.66
Dimensions
A
B
C
D
E
F
G
H
J
K
L
M
N
Inches
Min
0.530
0.360
Propagation Delay:
Max
0.550
0.380
50%
ENABLE
50%
2.05 Nominal
3.56 Nominal
2.24 Nominal
1.27 Nominal
2.54 Nominal
3.05 Nominal
1.93 Nominal
5.54 Nominal
4.32 Nominal
4.83 Nominal
0.50 Nominal
0.081 Nominal
0.141 Nominal
0.088 Nominal
0.050 Nominal
0.100 Nominal
0.120 Nominal
0.076 Nominal
0.218 Nominal
0.170 Nominal
0.190 Nominal
0.020 Nominal
Symmetry as
% of Period
Period
50%
Symmetry:
Q or Q Output
Amplitude
Envelope
90%
10%
t
PD
t
PD
Q or Q Output
50%
50%
Symmetry as
% of Period
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E-mail: info@rfm.com
©2008 by RF Monolithics, Inc.
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