Preliminary document
Specifications in this document are tentative and subject to change.
Under development
R8C/34W Group, R8C/34X Group, R8C/34Y Group, R8C/34Z Group
1. Overview
Table 1.10
Product List for R8C/34X Group
Current of Apr. 2010
Remarks
J version
ROM Capacity
Part No.
RAM Capacity
Package Type
Program ROM
32 Kbytes
48 Kbytes
64 Kbytes
96 Kbytes
128 Kbytes
32 Kbytes
48 Kbytes
64 Kbytes
96 Kbytes
128 Kbytes
R5F21346XJFP (D)
R5F21347XJFP (D)
R5F21348XJFP (D)
R5F2134AXJFP (D)
R5F2134CXJFP (D)
R5F21346XKFP (D)
R5F21347XKFP (D)
R5F21348XKFP (D)
R5F2134AXKFP (D)
R5F2134CXKFP (D)
2.5 Kbytes
4 Kbytes
6 Kbytes
8 Kbytes
10 Kbytes
2.5 Kbytes
4 Kbytes
6 Kbytes
8 Kbytes
10 Kbytes
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
PLQP0048KB-A
K version
(D): Under development
Part No. R 5 F 21 34 6 X J FP
Package type:
FP: PLQP0048KB-A (0.5 mm pin-pitch, 7 mm square body)
CAN, Data Flash
W: CAN module and Data Flash
X : CAN module but no Data Flash
Y : Data Flash but no CAN module
Z : None
Classification
J: Operating ambient temperature −40 °C to 85 °C
K: Operating ambient temperature −40 °C to 125 °C
ROM capacity
6: 32 KB
7: 48 KB
8: 64 KB
A: 96 KB
C: 128 KB
R8C/34X Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.2
Part Number, Memory Size, and Package of R8C/34X Group
REJ03B0312-0010 Rev.0.10
Apr 09, 2010
Page 11 of 67
RENESAS [ RENESAS TECHNOLOGY CORP ]
