CD4051BMS, CD4052BMS, CD4053BMS
Chip Dimensions and Pad Layouts
CD4051BMSH
CD4052BMSH
CD4053BMSH
Dimensions in parentheses are in millimeters and are
derived from the basic inch dimensions as indicated.
-3
Grid graduations are in mils (10 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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RENESAS [ RENESAS TECHNOLOGY CORP ]
