RDA Microelectronics, Inc.
RDA1846S Datasheet V0.1
Table 10-2 SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
≥350
＜2.5mm
≥2.5mm
240 + 0/-5 o C
225 + 0/-5 o C
225 + 0/-5 o C
225 + 0/-5 o C
Table 10-3 Pb-free Process – Package Classification Reflow Temperatures
Package
Volume mm3
Volume mm3
350-2000
Volume mm3
Thickness
＜350
＞2000
＜1.6mm
1.6mm – 2.5mm
≥2.5mm
260 + 0 o C *
260 + 0 o C *
250 + 0 o C *
260 + 0 o C *
250 + 0 o C *
245 + 0 o C *
260 + 0 o C *
245 + 0 o C *
245 + 0 o C *
*Tolerance : The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature(this mean Peak reflow temperature + 0 o C. For
example 260+ 0 o C ) at the rated MSL Level.
Note 1: All temperature refer topside of the package. Measured on the package body surface.
Note 2: The profiling tolerance is + 0 o C, - X o C (based on machine variation capability)whatever
is required to control the profile process but at no time will it exceed - 5 o C. The producer
assures process compatibility at the peak reflow profile temperatures defined in Table –III.
Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non integral
heat sinks.
Note 4: The maximum component temperature reached during reflow depends on package the
thickness and volume. The use of convection reflow processes reduces the thermal
gradients between packages. However, thermal gradients due to differences in thermal
mass of SMD package may sill exist.
Note 5: Components intended for use in a “lead-free” assembly process shall be evaluated using
the “lead free” classification temperatures and profiles defined in Table-I II III whether or not
lead free.
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
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