RDA Microelectronics, Inc.
RDA1846S Datasheet V0.1
10. Solder Mounting Condition
Classification Reflow Profile
Table 10-1 Classification Reflow Profiles
Sn-Pb Eutectic Assembly
3 oC/second max.
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate
(TSmax to Tp)
3 oC/second max.
Preheat
-Temperature Min (Tsmin
)
100 oC
100 oC
150 oC
200 oC
-Temperature Max (Tsmax
)
-Time (tsmin to tsmax
)
60-120 seconds
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
183 oC
217oC
60-150seconds
60-150 seconds
Peak /Classification
Temperature(Tp)
See Table-II
See Table-III
Time within 5 oC of actual
Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6 oC/second max.
6 minutes max.
6 oC/seconds max.
8 minutes max.
Time 25 oC to Peak
Temperature
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 13 of 16
RDC [ RDC SEMICONDUCTOR ]
