FM25L256 Extended Temp.
Revision History
Revision
0.1
0.11
Date
9/9/03
12/9/03
1/7/04
Summary
Initial release.
Reduced IDD spec limits.
Added tVR and tVF specs, “green” package, and modified Power Cycling
diagram.
0.12
0.13
1.0
5/5/04
Changed tOD, tODV , and tLZ timing specs. Changed ISB spec limit. Changed tVR
and tVF conditions. Changed voltage/temperature conditions in AC Parameters
table.
8/12/04
Added DFN mechanical package drawing and ordering information. Added
ISB limits at various temperatures. Changed AC timing reference to 0.5 VDD
Changed tODV spec. New rev. number to comply with new scheme.
.
1.1
1.2
9/21/04
3/9/05
Changed IDD limits. Added Power Down timing parameter and changed
diagram.
Removed “preliminary” from DFN package drawing. Added note about
D
E
powering down with /CS active (pg 3). Added ESD and package MSL
ratings.
D
2.0
2.1
4/5/05
7/20/05
Changed to Pre-Production status.
S
Split into commercial and extended temp datasheets. Changed min. temp to
N
-25C and VDD min to 3.0V. Added recommended pcb footprint to DFN
N
package drawing.
2.2
2.3
9/14/05
3/26/07
Added power up note to Power Cycle Timing table. Package name change,
G
from DFN to TDFN.
ME
I
Not recommended for new designs. Use FM25L256B as an alternative.
B
S
6
M
5
E
2
O
L
D
5
C
2
E
M
W
F
R
:
E
e
v
i
t
T
N
a
O
N
n
r
R
e
t
l
O
A
F
Rev. 2.3
March 2007
Page 14 of 14
RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
