FM24CL16
Revision History
Revision
1.0
Date
Summary
Initial Release.
2/15/01
9/29/01
2/22/02
1.1
2.0
Endurance changed to unlimited.
Changed to Production status. Added clarification to package standard and
changed package name to SOIC.
2.1
2.2
3.0
3.1
3/24/03
6/24/04
7/14/04
11/19/04
Added “green” packaging option.
Changed storage temp range -55 to +125 C. Removed Data Retention note.
Changed IDD limits. New rev. number to comply with updated scheme.
Added DFN package ordering option and added mechanical drawing. Added
pcb footprint drawings. Increased Idd @ 1MHz to 450uA.
Changed Data Retention spec. Added ESD and package MSL ratings.
Removed “preliminary” from DFN package drawing.
3.2
3.3
3/8/05
11/28/05
Changed package name from DFN to TDFN. Fixed formatting of notes in DC
table. Removed ref to note 4 on VIH and VIL parameters. Added note to VHYS
.
Rev 3.3
Nov. 2005
Page 13 of 13
RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
