4.8 Mechanical - 32-QFN Package
Dimensions In Millimeters
Symbol Minimum Nominal Maximum
A
A1
b
C
D
D2
E
E2
e
L
y
0.70
0.00
0.18
-
4.90
3.05
4.90
3.05
-
-
0.02
0.25
0.20 REF
5.00
-
5.00
-
0.50
0.40
-
0.90
0.05
0.32
-
5.10
3.65
5.10
3.65
-
0.30
0.00
0.50
0.075
Note that there is no functional requirement for the large pad on the underside of the 32-QFN
package to be soldered to the substrate. If the final application does require this area to be soldered
for mechanical reasons, the pad(s) to which it is soldered to must be isolated and contained under
the 32-QFN footprint only.
Lq
14
QT1101 R4.06/0806
QUANTUM [ QUANTUM RESEARCH GROUP ]
