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MSM6500 参数 Datasheet PDF下载

MSM6500图片预览
型号: MSM6500
PDF下载: 下载PDF文件 查看货源
内容描述: MSM6500⑩芯片组解决方案 [MSM6500⑩ CHIPSET SOLUTION]
分类和应用:
文件页数/大小: 8 页 / 366 K
品牌: QUANTUM [ QUANTUM RESEARCH GROUP ]
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Q U A L C O M M C D M A T E C H N O L O G I E S  
HTTP://WWW.CDMATECH.COM  
E N A B L I N G T H E F U T U R E O F C O M M U N I C A T I O N S  
6
MSM6500CHIPSET SOLUTION  
Included on the chip is the GPS LNA as well as the entire GPS VCO,  
including resonant components. The Rx PLL, which resides on the  
transmit companion chipset (the RFT6100 device), is switched  
between the GPS Voltage Control Oscillator (VCO) and the external  
Rx VCO.  
RFL6000 Device Description  
Integrated into the RFL6000 device are two low-  
noise amplifiers (LNAs): a cellular LNA and PCS  
LNA. Both LNAs utilize three gain settings that  
are programmable through the SBI.  
Extension of standby time is achieved by selective circuit power  
down, gain control and bias current. These features, along with all  
radioOne chipset functions, are controlled by the MSM.  
Operating modes—sleep, Rx, and Rx/Tx—as  
well as LNA bias currents are all automatically adjusted via software  
to minimize DC power consumption. Depending on handset status,  
the LNA bias current adjusts to meet RF performance requirements  
with minimal power consumption.  
The RFR6000 device is designed to operate with 2.7 to 3.1 V power  
supplies and is compatible with single-cell Li-Ion batteries.  
Compatibility to the lower voltage (1.8 to 3.1 V) is assured when  
VDDM is connected to the MSM pad voltage.  
The RFL6000 device is fabricated using SiGe BiCMOS process,  
which is suited for high performance RF circuits, and is packaged in  
a very small 16-pin bump chip carrier (16-pin BCC++).  
The RFR6000 chip is fabricated using a SiGe BiCMOS process,  
which provides high-frequency, high-precision analog circuits as well  
as low-power CMOS functions. Package type is 40 BCCP, which  
includes a large ground slug for improved grounding, mechanical  
strength and thermal conductivity.  
RFL6000 Device Features  
• Reduction in component count, space and cost via radioOne  
chipset that eliminates receiver and transmitter IF  
Two integrated LNAs with programmable gain steps  
• Cellular LNA supports CDMA and FM modes  
– Cellular bands of operation in China, Japan, Korea, and the  
United States  
RFR6000 Device Features  
• Compatibility with QCT’s radioOne Zero IF chipset that eliminates  
the entire IF and reduces component count and space  
• Single- or multi-band operation (cellular, PCS, GPS)  
• Single- or multimode operation: cellular CDMA, PCS CDMA,  
cellular FM and GPS  
– Three CDMA gain settings  
Two FM gain settings  
• PCS LNA supports PCS CDMA operation  
– PCS bands of operation in China, Korea, and the United States  
– Three CDMA gain settings  
• Full downconversion—RF to baseband  
• Receive path circuitry  
• Programmable mode and bias control to reduce DC power  
consumption  
– GPS LNA  
– Stepped gain control  
• High reverse isolation  
– Three-quadrature down converter  
• Efficient three-line SBI  
– Band-specific low-pass filter  
• Low power consumption  
• Baseband amplifiers with DC offset adjustment  
• Need for only one single-band external VCO (Rx VCO) for all  
CDMA bands of operation for entire radioOne chipset.  
• Includes entire on-chip GPS VCO—including resonant circuit  
• Individual circuit power on/off controls  
• Power reduction feature control and extended handset standby  
time  
• Small package: 16-pin BCC++ (4 mm x 4 mm)  
• SiGe BiCMOS process fabrication  
RFR6000 Device Description  
The RFR6000 device is the radioOne zero IF  
downconverter. The device has three mixers  
which, when combined with the RFL6000  
device, provide full RF-to-baseband  
– Selective circuit power-down  
– Gain and bias controls  
downconversion for the cellular, PCS and GPS  
bands. The LO generation block produces all LO  
signals, and only one external single-band VCO is required for all  
CDMA frequency bands of operation.  
• Low power supply voltage (2.7 to 3.1 V), low power dissipation  
– Compatible with lower MSM voltage (1.8 to 3.0 Vdd)  
• Small, thermally efficient package (40 BCC++)  
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