Internet Data Sheet
HYS64T256022EDL–[25F/2.5/3/3S/3.7]–B
Small Outline DDR2 SDRAM Modules
1
Overview
This chapter gives an overview of the 200-Pin Dual Die Small-Outline-DDR2-SDRAM Modules product family and describes
its main characteristics.
1.1
Features
•
•
•
200-Pin PC2-6400, PC2–5300 and PC2-4200 DDR2
SDRAM memory modules.
256M × 64 module organization, and 2 × 128M × 8 chip
organization
Standard Double-Data-Rate-Two Synchronous DRAMs
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
2GB Modules built with stacked 1Gb DDR2 SDRAMs in
PG-TFBGA-71 chipsize packages
All speed grades faster than DDR2-400 comply with
DDR2-400 timing specifications.
Programmable CAS Latencies (3, 4, 5 and 6), Burst
Length (8 & 4) and Burst Type
•
•
•
Programmable self refresh rate via EMRS2 setting
Programmable partial array refresh via EMRS2 settings
Average Refresh Period 7.8 µs at a TCASE lower than 85°C,
3.9µs between 85°C and 95°C.
•
•
•
DCC enabling via EMRS2 setting
All inputs and outputs SSTL_18 compatible
Off-Chip Driver Impedance Adjustment (OCD) and On-Die
Termination (ODT)
•
•
•
•
•
Serial Presence Detect with E2PROM
SO-DIMM Dimensions (nominal):
30 mm high, 67.6 mm wide
•
•
Based on Standard reference layouts Raw Card “D”
RoHS Compliant Products1)
• Burst Refresh, Distributed Refresh and Self Refresh
TABLE 1
Performance Table
Product Type Speed Code
Speed Grade
–25F
–2.5
–3
–3S
–3.7
Unit
PC2–6400 PC2–6400 PC2–5300 PC2–5300 PC2–4200
—
5–5–5
6–6–6
4–4–4
5–5–5
4–4–4
Max. Clock Frequency
@CL6
@CL5
@CL4
@CL3
fCK6 400
400
333
266
200
15
–
–
–
MHz
MHz
MHz
MHz
ns
fCK5 400
fCK4 266
fCK3 200
tRCD 12.5
333
333
200
12
333
266
200
15
266
266
200
15
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
tRP
tRAS 45
tRC 57.5
12.5
15
12
15
15
ns
45
45
45
45
ns
60
57
60
60
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.0, 2006-11
3
11172006-DXYK-2PPW
QIMONDA [ QIMONDA AG ]
