Internet Data Sheet
HYS[64/72]T256020EU-[25F/2.5/3/3S/3.7]-B
Unbuffered DDR2 SDRAM Module
1
Overview
This chapter gives an overview of the 240-Pin unbuffered DDR2 SDRAM Modules product family and describes its main
characteristics.
1.1
Features
•
•
•
240-Pin PC2–6400, PC2–5300 and PC2–4200 DDR2
SDRAM memory modules.
256M × 64 and 256M ×72 module organization,and
128M × 8 chip organization
Standard Double-Data-Rate-Two Synchronous DRAMs
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
2 GB Built with 1Gbit DDR2 SDRAMs in and
P-TFBGA-68-6 chipsize packages
All speed grades faster than DDR400 comply with
DDR400 timing specifications.
Programmable CAS Latencies (3, 4, 5 and 6), Burst
Length (8 & 4) and Burst Type
Average Refresh Period 7.8 µs at a TCASE lower than 85°C,
3.9µs between 85°C and 95°C.
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•
•
•
•
•
Auto Refresh (CBR) and Self Refresh
Programmable self refresh rate via EMRS2 setting
Programmable partial array refresh via EMRS2 settings
DCC enabling via EMRS2 setting
All inputs and outputs SSTL_1.8 compatible
Off-Chip Driver Impedance Adjustment (OCD) and On-Die
Termination (ODT)
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•
•
•
•
•
Serial Presence Detect with E2PROM
UDIMM and EDIMM Dimensions (nominal):
30 mm high, 133.35 mm wide
•
•
Based on standard reference layouts Raw Card “E” and
“G”
RoHS compliant products1)
TABLE 1
Performance Table
Product Type Speed Code
Speed Grade
–25F
–2.5
–3
–3S
–3.7
Unit
PC2–6400
5–5–5
PC2–6400
6–6–6
PC2–5300
4–4–4
PC2–5300
5–5–5
PC2–4200
4–4–4
—
Max. Clock Frequency
@CL6 fCK6 400
@CL5 fCK5 400
400
333
266
200
15
–
–
–
MHz
MHz
MHz
MHz
ns
333
333
200
12
333
266
200
15
266
266
200
15
@CL4 fCK4 266
@CL3 fCK3 200
tRCD 12.5
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
tRP 12.5
15
12
15
15
ns
tRAS 45
45
45
45
45
ns
tRC 57.5
60
57
60
60
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.0, 2006-10
3
10262006-SX8C-DEY8