Internet Data Sheet
HYI25D512160C[C/E/F/T]
512-Mbit Double-Data-Rate SDRAM
5
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
•
TABLE 23
TFBGA Common Package Properties (non-green/green)
Description
Size
Units
Ball Size
0.460
0.350
0.450
mm
mm
mm
Recommended Landing Pad
Recommended Solder Mask
FIGURE 4
Package Outline P(G)-TFBGA-60-11
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Notes
1. Drawing according to ISO 8015
2. Dimensions in mm
3. General tolerances +/- 0.15
Rev. 1.0, 2006-11
30
11082006-S9OT-UFSN
QIMONDA [ QIMONDA AG ]
