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HYB18TC512800BF-25F 参数 Datasheet PDF下载

HYB18TC512800BF-25F图片预览
型号: HYB18TC512800BF-25F
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 64MX8, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60]
分类和应用: 时钟动态存储器双倍数据速率内存集成电路
文件页数/大小: 62 页 / 1954 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYB18TC512[80/16]0BF  
512-Mbit Double-Data-Rate-Two SDRAM  
1.2  
Description  
The 512-Mb DDR2 DRAM is a high-speed Double-Data-  
Rate-Two CMOS DRAM device containing 536,870,912 bits  
and is internally configured as an quad-bank DRAM. The  
512-Mb device is organized as either 16 Mbit ×8 I/O ×  
4 banks or 8 Mbit ×16 I/O ×4 banks chip. These devices  
achieve high speed transfer rates starting at 400 Mb/sec/pin  
for general applications. See Table 1 for performance figures.  
latched at the cross point of differential clocks (CK rising and  
CK falling). All I/Os are synchronized with a single ended  
DQS or differential DQS-DQS pair in a source synchronous  
fashion.  
A 16-bit address bus for ×8 organized components and a  
15-bit address bus for ×16 components is used to convey  
row, column and bank address information in a RAS-CAS  
multiplexing style.  
The device is designed to comply with all DDR2 DRAM key  
features:  
The DDR2 device operates with a 1.8 V ± 0.1 V power  
supply. An Auto-Refresh and Self-Refresh mode is provided  
along with various power-saving power-down modes.  
1. Posted CAS with additive latency  
2. Write latency = read latency - 1  
3. Normal and weak strength data-output driver  
4. Off-Chip Driver (OCD) impedance adjustment  
5. On-Die Termination (ODT) function  
The functionality described and the timing specifications  
included in this data sheet are for the DLL Enabled mode of  
operation.  
All of the control and address inputs are synchronized with a  
pair of externally supplied differential clocks. Inputs are  
The DDR2 SDRAM is available in FBGA package.  
TABLE 5  
Ordering Information for Lead-Free Products (RoHS Compliant)  
Product Type1)  
HYB18TC512160BF-25F ×16 DDR2-800D 5-5-5  
HYB18TC512800BF-25F ×8 DDR2-800D 5-5-5  
×16 DDR2-800E 6-6-6  
×8 DDR2-800E 6-6-6  
×16 DDR2-667D 5-5-5  
×8 DDR2-667D 5-5-5  
×16 DDR2-533C 4-4-4  
×8 DDR2-533C 4-4-4  
×16 DDR2-400B 3-3-3  
×8 DDR2-400B 3-3-3  
Org. Speed  
CAS-RCD-RP Latencies2)  
Clock (MHz) Package  
Note  
3)  
400  
400  
400  
400  
333  
333  
266  
266  
200  
200  
PG-TFBGA-84  
PG-TFBGA-60  
PG-TFBGA-84  
PG-TFBGA-60  
PG-TFBGA-84  
PG-TFBGA-60  
PG-TFBGA-84  
PG-TFBGA-60  
PG-TFBGA-84  
PG-TFBGA-60  
HYB18TC512160BF-2.5  
HYB18TC512800BF-2.5  
HYB18TC512160BF-3S  
HYB18TC512800BF-3S  
HYB18TC512160BF-3.7  
HYB18TC512800BF-3.7  
HYB18TC512160BF-5  
HYB18TC512800BF-5  
1) Please check with your Qimonda representative that leadtime and availability of your preferred device type and version meet your project  
requirements.  
2) CAS: Column Address Strobe, RCD: Row Column Delay, RP: Row Precharge  
3) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined  
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,  
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.  
Note: For product nomenclature see Chapter 9 of this data sheet  
Rev. 1.21, 2007-09  
5
03292006-HDLH-OAY6