Internet Data Sheet
HYB18TC512[80/16]0BF
512-Mbit Double-Data-Rate-Two SDRAM
12) The tHZ, tRPST and tLZ, tRPRE parameters are referenced to a specific voltage level, which specify when the device output is no longer driving
(tHZ, tRPST), or begins driving (tLZ, tRPRE). tHZ and tLZ transitions occur in the same access time windows as valid data transitions.These
parameters are verified by design and characterization, but not subject to production test.
13) The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range between 85 °C
and 95 °C.
14) 0 °C≤ TCASE ≤ 85 °C
15) 85 °C < TCASE ≤ 95 °C
16) A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.
17) The tRRD timing parameter depends on the page size of the DRAM organization. See Table 5 “Ordering Information for Lead-Free
Products (RoHS Compliant)” on Page 5.
18) The maximum limit for the tWPST parameter is not a device limit. The device operates with a greater value for this parameter, but system
performance (bus turnaround) degrades accordingly.
19) Minimum tWTR is two clocks when operating the DDR2-SDRAM at frequencies ≤ 200 ΜΗz.
20) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard active power-
down mode” (MR, A12 = “0”) a fast power-down exit timing tXARD can be used. In “low active power-down mode” (MR, A12 =”1”) a slow
power-down exit timing tXARDS has to be satisfied.
21) WR must be programmed to fulfill the minimum requirement for the tWR timing parameter, where WRMIN[cycles] = tWR(ns)/tCK(ns) rounded
up to the next integer value. tDAL = WR + (tRP/tCK). For each of the terms, if not already an integer, round to the next highest integer. tCK
refers to the application clock period. WR refers to the WR parameter stored in the MRS.
TABLE 48
DRAM Component Timing Parameter by Speed Grade - DDR2-400
Parameter
Symbol
DDR2–400
Unit
Notes1)2)3)4)5)
6)
Min.
Max.
DQ output access time from CK / CK
CAS A to CAS B command period
CK, CK high-level width
tAC
–600
2
+600
—
ps
tCCD
tCH
tCKE
tCL
tCK
tCK
tCK
tCK
tCK
0.45
3
0.55
—
CKE minimum high and low pulse width
CK, CK low-level width
0.45
WR + tRP
0.55
—
7)20)
8)
Auto-Precharge write recovery + precharge
time
tDAL
Minimum time clocks remain ON after CKE
asynchronously drops LOW
tDELAY
tIS + tCK + tIH
––
––
—
ns
ps
ps
9)
DQ and DM input hold time (differential data
strobe)
t
t
DH(base)
275
25
10)
DQ and DM input hold time (single ended data
strobe)
DH1(base)
DQ and DM input pulse width (each input)
DQS output access time from CK / CK
tDIPW
0.35
–500
0.35
—
—
tCK
ps
tCK
ps
tDQSCK
+500
—
DQS input low (high) pulse width (write cycle) tDQSL,H
10)
DQS-DQ skew (for DQS & associated DQ
signals)
tDQSQ
350
Write command to 1st DQS latching transition tDQSS
– 0.25
150
+ 0.25
—
tCK
10)
10)
DQ and DM input setup time (differential data
strobe)
t
DS(base)
ps
DQ and DM input setup time (single ended
data strobe)
t
DS1(base)
25
—
ps
Rev. 1.21, 2007-09
47
03292006-HDLH-OAY6
QIMONDA [ QIMONDA AG ]
