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HYB15T1G400C2F-3S 参数 Datasheet PDF下载

HYB15T1G400C2F-3S图片预览
型号: HYB15T1G400C2F-3S
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, PLASTIC, TFBGA-60]
分类和应用: 时钟动态存储器双倍数据速率内存集成电路
文件页数/大小: 59 页 / 1885 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYB15T1G[40/80/16]0C2F  
1-Gbit Double-Data-Rate-Two SDRAM  
TABLE 1  
Performance Table  
QAG Speed Code  
–25F  
–2.5  
–3S  
Unit  
Note  
DRAM Speed Grade  
DDR2  
–800D  
5–5–5  
–800E  
6–6–6  
–667D  
5–5–5  
CAS-RCD-RP latencies  
tCK  
Max. Clock Frequency  
CL3  
CL4  
CL5  
CL6  
fCK3  
fCK4  
fCK5  
fCK6  
tRCD  
tRP  
200  
266  
400  
400  
12.5  
12.5  
40  
200  
266  
333  
400  
15  
200  
266  
333  
MHz  
MHz  
MHz  
MHz  
ns  
Min. RAS-CAS-Delay  
Min. Row Precharge Time  
Min. Row Active Time  
Min. Row Cycle Time  
15  
15  
15  
ns  
tRAS  
tRC  
40  
40  
ns  
52.5  
15  
55  
55  
ns  
1)2)  
Precharge-All (8 banks) command period tPREA  
17.5  
18  
ns  
1) This tPREA value is the minimum value at which this chip will be functional.  
2) Precharge-All command for an 8 bank device will equal to tRP + 1 × tCK or tnRP + 1 × nCK, depending on the speed bin,  
where tnRP = RU{ tRP / tCK(avg) } and tRP is the value for a single bank precharge.  
1.2  
Description  
The 1-Gbit DDR2 DRAM is a high-speed Double-Data-Rate-  
Two CMOS Synchronous DRAM device containing  
1,073,741,824 bits and internally configured as an octal bank  
DRAM.  
The 1-Gbit device is organized as 32 Mbit ×4 I/O ×8 banks or  
16 Mbit ×8 I/O ×8 banks or 8 Mbit ×16 I/O ×8 banks chip.  
All of the control and address inputs are synchronized with a  
pair of externally supplied differential clocks. Inputs are  
latched at the cross point of differential clocks (CK rising and  
CK falling). All I/Os are synchronized with a single ended  
DQS or differential DQS-DQS pair in a source synchronous  
fashion.  
These synchronous devices achieve high speed transfer  
rates starting at 400 Mb/sec/pin for general applications. See  
Table 1 for performance figures.  
A 17 bit address bus for ×4 and ×8 organised components  
and a 16 bit address bus for ×16 components is used to  
convey row, column and bank address information in a RAS-  
CAS multiplexing style.  
The device is designed to comply with all DDR2 DRAM key  
features:  
The DDR2 device operates with VDD.MIN = VDDQ.MIN =1.45 V  
and VDD.MAX = VDDQ.MAX =1.9 V power supply. An Auto-  
Refresh and Self-Refresh mode is provided along with  
various power-saving power-down modes.  
1. Posted CAS with additive latency.  
2. Write latency = read latency - 1.  
3. Normal and weak strength data-output driver.  
4. Off-Chip Driver (OCD) impedance adjustment.  
5. On-Die Termination (ODT) function.  
The functionality described and the timing specifications  
included in this data sheet are for the DLL Enabled mode of  
operation.  
The DDR2 SDRAM is available in TFBGA package.  
Rev. 1.00, 2008-08  
4
11202007-1NZ2-6U4E