May 2007
rev 0.2
PCS5P23Z05B/09B
16-lead (150 Mil) Molded SOIC Package
PIN 1 ID
1
8
H
E
9
16
h
D
Seating Plane
A2
A
C
θ
0.004
e
L
A1
B
Dimensions
Symbol
Inches
Millimeters
Min
Max
0.069
0.010
0.059
0.022
0.012
0.394
0.157
Min
1.35
0.10
1.25
0.33
0.19
9.80
3.80
Max
1.75
0.25
1.50
0.53
0.27
10.01
4.00
A
A1
A2
B
0.053
0.004
0.049
0.013
0.008
0.386
0.150
C
D
E
e
0.050 BSC
1.27 BSC
H
h
0.228
0.010
0.016
0°
0.244
0.016
0.035
8°
5.80
0.25
0.40
0°
6.20
0.41
0.89
8°
L
θ
Timing-Safe™ Peak EMI Reduction IC
10 of 14
Notice: The information in this document is subject to change without notice.