February 2007
ASM3P1819N
rev 0.3
Pin Configuration
XOUT
1
2
3
4
8
7
6
5
XIN
VSS
VDD
PD#
REF
ASM3P1819N
NC
ModOUT
Pin Description
Pin#
Pin Name
Type
Description
1
2
3
4
5
XIN
VSS
I
Connect to externally generated Clock signal or Crystal.
Ground Connection. Connect to system ground.
No Connect.
P
-
NC
ModOUT
REF
O
O
Spread spectrum clock output.
Non-modulated Reference clock output of the input frequency.
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
Connect to +3.3V.
6
7
8
PD#
VDD
I
P
I
XOUT
Connect to crystal. No connect if externally generated clock signal is used.
Absolute Maximum Ratings
Symbol
Parameter
Rating
-0.5 to +4.6
-65 to +125
-40 to +85
260
Unit
V
°C
°C
°C
°C
VDD, VIN
Voltage on any pin with respect to Ground
TSTG
TA
Storage temperature
Operating temperature
Ts
TJ
Max. Soldering Temperature (10 sec)
Junction Temperature
150
Static Discharge Voltage
TDV
2
KV
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Output Frequency and Modulation Rate
Input Frequency Range
Output Frequency Range
Modulation Rate
Spread Deviation
(MHz)
(MHz)
(%)
20 to 40
20 to 40
Input Frequency / 512
-1.25
Low Power Mobile VGA EMI Reduction IC
2 of 7
Notice: The information in this document is subject to change without notice.
PULSECORE [ PulseCore Semiconductor ]
