TOP252-262
eSIP-7F (L Package)
C
2
0.403 (10.24)
0.397 (10.08)
0.081 (2.06)
0.077 (1.96)
A
0.224 (5.69) Ref.
B
0.325 (8.25)
0.320 (8.13)
0.290 (7.37)
Ref.
0.177 (4.50) Ref.
2
3
0.490 (12.45) Ref.
0.016 (0.41)
0.011 (0.28)
6×
0.020 M 0.51 M C
0.173 (4.40)
0.163 (4.15)
1
7
7
1
0.084 (2.14)
Pin 1 I.D.
0.089 (2.26)
0.079 (2.01)
0.047 (1.19) Ref.
0.070 (1.78) Ref.
3
4
0.100 (2.54)
0.050 (1.27)
0.033 (0.84)
0.028 (0.71)
0.113 (2.88)
0.106 (2.68)
6×
0.010 M 0.25 M C A B
TOP VIEW
BOTTOM VIEW
SIDE VIEW
1
7
0.021 (0.53)
0.019 (0.48)
Notes:
0.060 (1.52) Ref.
0.020 (0.50)
1. Dimensioning and tolerancing
per ASME Y14.5M-1994.
2. Dimensions noted are determined
at the outermost extremes of the plastic
body exclusive of mold flash, tie bar
burrs, gate burrs, and interlead flash,
but including any mismatch between the
top and bottom of the plastic body.
3. Dimensions noted are inclusive of
plating thickness.
0.019 (0.48) Ref.
0.378 (9.60)
Ref.
0.048 (1.22)
0.046 (1.17)
0.023 (0.58)
0.027 (0.70)
END VIEW
4. Does not include inter-lead flash or
protrusions.
5. Controlling dimensions in inches (mm).
DETAIL A
PI-5204-073108
器件订购信息
• TOPSwitch产品系列
• HX序列号
• 封装信息
P
塑封DIP-8C
G
塑封SMD-8C
塑封SDIP-10C
塑封TO-220-7C
塑封eSIP-7C
塑封eSIP-7F
M
Y
E
L
• 引脚封装
N
纯镀锡封装（Pb-Free）（P、G、M、E、L和Y封装）
• 带装&卷轴装及其他包装形式
空白
标准配置
TOP 258
P N - TL
TL
G封装(1000 min/mult.)
47
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版本D 08/08
POWERINT [ Power Integrations ]
