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LNK6775K 参数 Datasheet PDF下载

LNK6775K图片预览
型号: LNK6775K
PDF下载: 下载PDF文件 查看货源
内容描述: [IC OFFLINE SW PSR 12ESOP]
分类和应用: 光电二极管
文件页数/大小: 24 页 / 2266 K
品牌: POWERINT [ Power Integrations ]
 浏览型号LNK6775K的Datasheet PDF文件第8页浏览型号LNK6775K的Datasheet PDF文件第9页浏览型号LNK6775K的Datasheet PDF文件第10页浏览型号LNK6775K的Datasheet PDF文件第11页浏览型号LNK6775K的Datasheet PDF文件第13页浏览型号LNK6775K的Datasheet PDF文件第14页浏览型号LNK6775K的Datasheet PDF文件第15页浏览型号LNK6775K的Datasheet PDF文件第16页  
LinkSwitch-HP  
Absolute Maximum Ratings(3)  
DRAIN Pin Voltage ...................................-0.3 V to 725 V (677x) Notes:  
DRAIN Pin Voltage ..........................-0.3 V to 650 V (666x/676x) 1. Peak DRAIN current is allowed while the DRAIN voltage is  
(1)  
DRAIN Pin Peak Current: …………………….......... 1.6 x ILIMIT(TYP)  
simultaneously less than 400 V.  
BYPASS Pin Voltage ..............................................-0.3 V to 9 V 2. -1 V for current pulses ≤5 mA out of the pin and a duration  
BYPASS Pin Current ..................................................... 100 mA of ≤500 ns.  
FEEDBACK Pin Voltage........................................-0.3 V to 9 V(2) 3. Maximum ratings specified may be applied one at a time  
COMPENSATION Pin Voltage ................................-0.3 V to 9 V  
PROGRAM/DELAY Pin Voltage..............................-0.3 V to 9 V  
Storage Temperature ...................................... -65 °C to 150 °C  
without causing permanent damage to the product.  
Exposure to Absolute Maximum Rating conditions for  
extended periods of time may affect product reliability.  
Operating Junction Temperature .................. -40 °C to 150 °C(4) 4. Normally limited by internal circuitry.  
Thermal Resistance  
Thermal Resistance: E Package  
Notes:  
(qJA) .......................................... 105 °C/W(1) 1. Free standing with no heat sink.  
(qJC).............................................. 2 °C/W(2) 2. Measured at the back surface of tab.  
3. Soldered (including exposed pad for K package) to typical  
K Package  
(qJA) ...........................45 °C/W(3), 38 °C/W(4)  
application PCB with a heat sinking area of 0.36 sq. in.  
(232 mm2), 2 oz. (610 g/m2) copper clad.  
(qJC).............................................. 2 °C/W(2)  
4. Soldered (including exposed pad for K package) to typical  
application PCB with a heat sinking area of 1 sq. in. (645 mm2),  
2 oz. (610 g/m2) copper clad.  
V Package  
(qJA) ...........................74 °C/W(3), 63 °C/W(4)  
(qJC).............................................. 2 °C/W(2)  
Conditions  
SOURCE = 0 V; TJ = -40 to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Control Functions  
Switching Frequency  
fOSC  
132  
136  
10  
kHz  
%
Average value, TJ = +25 °C,  
120  
Switching Frequency  
Temperature Variation  
ΔfOSC  
0 °C TJ +100 °C, See Note A  
Frequency Jitter  
Deviation  
Δf  
fOSC = 128 kHz  
5
kHz  
Frequency Jitter  
Modulation Rate  
fM  
250  
64  
Hz  
%
TJ = +25 °C  
62  
66  
Maximum Duty Cycle  
DCMAX  
ΔDCMAX  
VFB < VFB(REF)  
See Note A  
VFB(REF) = 2 V  
Maximum Duty Cycle  
Temperature Variation  
2%  
%
0 °C ≤ TJ +100 °C  
Minimum Peak  
Current to Set  
Current Limit Ratio  
TJ = +25 °C  
di/dt(KPS) = di/dt(ILIMIT)  
kPS  
22.5  
25  
25  
32  
%
Multi-Cycle Modulation  
Switching Frequency  
fMCM  
TJ = +25 °C  
kHz  
ms  
Multi-Cycle  
Modulation Max  
Off-Time  
LNK666x  
TJ = +25 °C  
0.5  
4
TMCM(OFF)  
LNK67xx  
Soft-Start Time  
tSOFT  
TJ = +25 °C  
TJ = +25 °C  
15  
ms  
ms  
Auto-Restart Shut-  
Down Default Delay  
tSD(AR)  
35  
tAR(ON)  
TJ = +25 °C, tSOFT + tSD(AR)  
First switch off-period  
50  
TAR(OFF)1  
Auto-Restart  
150  
ms  
TAR(OFF)2  
Subsequent switch off-periods  
1500  
12  
Rev. E 06/15  
www.power.com  
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