LNK500
ABSOLUTE MAXIMUM RATINGS(1,4)
DRAIN Voltage ..................................................-0.3Vto700V Notes:
DRAIN Peak Current......................................400 mA 1. All voltages referenced to SOURCE, TA = 25 °C.
CONTROLVoltage................................................ -0.3Vto9V 2. Normally limited by internal circuitry.
CONTROL Current (not to exceed 9 V)............100 mA 3. 1/16 in. from case for 5 seconds.
StorageTemperature..........................................-65°C to150°C 4. Maximum ratings specified may be applied, one at a time,
OperatingJunctionTemperature(2) .....................-40°C to150°C
Lead Temperature(3) ........................................................260 °C
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.
THERMAL IMPEDANCE
Thermal Impedance: P or G Package:
Notes:
(θJA) ........................... 70 °C/W(2); 55 °C/W(3) 1. Measured on pin 2 (SOURCE) close to plastic interface.
(θJC)(1) ............................................... 11 °C/W 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
Parameter
Symbol
Min
Typ
Max
Units
See Figure 12
(Unless Otherwise Specified)
CONTROL FUNCTIONS
Switching
fOSC
IC = IDCT, TJ = 25 °C
34.5
24
42
30
49.5
36
kHz
kHz
Frequency
Low Switching
Duty Cycle = DCLF
TJ = 25 °C
fOSC(LOW)
Frequency
Duty Cycle at Low
Switching
Frequency
Frequency Switching from fOSC to
fOSC(LOW), TJ = 25 °C
DCLF
2.4
1.8
3.8
5.2
4.5
%
%
Low Frequency
Duty Cycle Range
DC(RANGE)
Frequency = fOSC(LOW), TJ = 25 °C
3.15
Maximum Duty
Cycle
DCMAX
DCREG
IC = 1.5 mA
74
77
80
%
IC = IDCT, TJ = 25 °C
-0.45
-0.35
-0.25
%/µA
PWM Gain
CONTROL Pin
Current at 30%
Duty Cycle
TJ = 25 °C
See Figure 4
IDCT
2.21
2.30
2.39
mA
CONTROL Pin
Voltage
VC(IDCT)
IC = IDCT
5.5
60
5.75
90
6
V
Dynamic
Impedance
Ω
ZC
IC = IDCT,TJ = 25 °C
120
D
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