TISP7072F3, TISP7082F3
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1994 - REVISED MARCH 2000
MECHANICAL DATA
SL003
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SL003
9,75 (0.384)
9,25 (0.364)
3,40 (0.134)
3,20 (0.126)
Index
Notch
6,60 (0.260)
6,10 (0.240)
8,31 (0.327)
MAX
12,9 (0.492)
MAX
4,267 (0.168)
MIN
2
1
3
2,54 (0.100) Typical
(see Note A)
2 Places
0,356 (0.014)
0,203 (0.008)
1,854 (0.073)
MAX
0,711 (0.028)
0,559 (0.022)
3 Places
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
MDXXCE
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
C. Details of the previous dot index SL003 style, drawing reference MDXXAD, are given in the earlier publications.
P R O D U C T
I N F O R M A T I O N
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