TISP7072F3, TISP7082F3
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1994 - REVISED MARCH 2000
MECHANICAL DATA
P008
plastic dual-in-line package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centres. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering. Leads require no additional
cleaning or processing when used in soldered assembly.
P008
9,75 (0.384)
9,25 (0.364)
8
7
6
5
Index
Notch
6,60 (0.260)
6,10 (0.240)
1
2
3
4
8,23 (0.324)
7,62 (0.300)
1,78 (0.070) MAX
4 Places
5,08 (0.200)
MAX
Seating
Plane
3,17 (0.125)
MIN
0,36 (0.014)
0,20 (0.008)
0,51 (0.020)
MIN
0,53 (0.021)
0,38 (0.015)
8 Places
9,40 (0.370)
8,38 (0.330)
2,54 (0.100) Typical
(see Note A)
6 Places
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
MDXXCF
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
P R O D U C T
I N F O R M A T I O N
20
POINN [ POWER INNOVATIONS LTD ]
