RELEASED
PMC-Sierra, Inc.
PM9311/2/3/5 ETT1™ CHIP SET
Data Sheet
PMC-2000164
ISSUE 3
ENHANCED TT1™ SWITCH FABRIC
6.3 RECOMMENDED OPERATING CONDITIONS
Table 50. Recommended Operating Conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VDD
SupplyVoltage
2.4
2.6
V
HSTL Output
Supply Voltage
VDDQ
1.5
1.6
1.7
23
Mechanically
Isolated Heat Sink
Applied Force
Fhssch,
Fhsxbar
lbs
lbs
Mechanically
Isolated Heat Sink
Applied Force
Fhsepp
13
30
Attached Heat Sink
Mass
g
g
Mhsds, Mhsepp
Attached Heat Sink
Mass
50
85
Mhsxbar, Mhssch
o
Tj
JuncOperTemp
EPP Heat Transfer
DS Heat Transfer
XBAR Heat Transfer
SCH Heat Transfer
10
C
Θjcepp
Θjcds
0.36
Incident air
velocity = 2 m/s
o
C/W
Θjcxbar
Θjcsch
0.36
0.26
6 DS Loads
ref_clk =200mHz
PDepp6
PDepp7
EPP Power Diss
EPP Power Diss
8.68
8.68
9.62
9.62
10.60
10.60
7 DS Loads
ref_clk =200mHz
EPP Header Data
Connections
ref_clk =200mHz
PDds01
PDds45
DS Power Diss
DS Power Diss
3.82
3.65
4.24
4.04
4.67
4.45
W
No Header
Connections
ref_clk =200mHz
PDxbar
PDsch
XBAR Power Diss
SCH Power Diss
9.52
10.55
21.10
11.63
23.26
ref_clk =200mHz
19.04
NOTE: Power dissipation is based on 2.5 V +/-5% supply. Power is dissipated within the package,
and can be used for heat transfer calculations. Power dissipation for 1.5V HSTL output is
primarily external to the device package, through the termination resistors, see Table 51.
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
299
PMC [ PMC-SIERRA, INC ]
