NSE-8G™ Standard Product Data Sheet
Preliminary
18 Ordering and Thermal Information
18.1 Packaging Information
Part No.
Description
480 Uni Ball Grid Array (UBGA) Package
PM8621-BIAP
18.2 Thermal Information
In full operation (10–12 ports), the NSE-8G is designed to operate over a wide
temperature range when used with a heat sink with a worst case Junction to case
Tj (Tjc) of 1 °C/W and is suited for industrial applications such as outside plant
equipment
Maximum long-term operating junction temperature to ensure adequate long-term life
105 0C
Maximum junction temperature for short-term excursions with guaranteed continued functional 125 0C
1
performance. This condition will typically be reached when local ambient reaches 70 Deg C.
Minimum ambient temperature
-400C
2
Ambient
Device Compact Model
ΘJC (0C/W)
ΘJB (0C/W)
# 1
# 4
SA
Θ
Heat Sink
Operating power is dissipated in package
(watts) at worst case power supply
Θ
CS
Power (watts)
2.56
Case
Θ
JC
Device Compact
Model
ΘSA and ΘCS required for long-
3
term operation
Junction
4
ΘSA + ΘCS (0C/W)
#5
Θ
JB
Board
Notes
1. Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core
2. ΘJC, the junction-to-case thermal resistance is a measured nominal value + 2 sigma. ΘJB, the junction-
to-board thermal resistance is obtained by simulating conditions described in JEDEC Standard, JESD
51
3. ΘSA is the thermal resistance of the heat sink to ambient. ΘCS is the thermal resistance of the heat sink
attached material
4. The actual ΘSA required may vary according to the air speed at the location of the device in the system
with all the components in place
Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
Document ID: PMC-2010850, Issue 1
180
PMC [ PMC-SIERRA, INC ]
