PRELIMINARY
PM4318 OCTLIU
DATASHEET
PMC- 2001578
ISSUE 3
OCTAL E1/T1/J1 LINE INTERFACE DEVICE
18
ORDERING AND THERMAL INFORMATION
Table 59 – Ordering Information
Part No.
Description
288-pin Tape Super Ball Grid Array (TSBGA)
PM4318-BI
Table 60 – OCTLIU Theta Jc
PART NO.
CASE TEMPERATURE
-40°C to +85°C
Theta Jc
PM4318-BI
1.0 °C/W
Table 61 – OCTLIU Junction Temperature
PM4318-BI
Maximum Junction Temperature for Long Term Reliability
110 °C
Table 62 – OCTLIU Theta Ja vs. Airflow
Forced Air (Linear Feet per Minute)
Part No.
Case
Temperature
Theta J-A at
2.5 Watts
Conv
100
200
300
400
500
Dense Board1
JEDEC Board2
32.8
13.7
30.1
12.0
28.3
10.8
27.2
10.0
26.7
9.4
26.5
9.0
-40°C to 85°C
PM4318-BI
1. – Dense Board is defined as a 3S3P board and consists of a 3x3 array of PM4318-BI devices
located as close to each other as board design rules allow. All PM4318-BI devices are assumed
to be dissipating maximum power. Theta J-A listed is for the device in the middle of the array.
2. – JEDEC Board Theta J-A is the measured value for a single thermal device in the same
package on a 2S2P board following EIA/JESD 51-3.
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
232
PMC [ PMC-SIERRA, INC ]
