PixArt Imaging Inc.
ADNS-7550 Integrated Molded Lead-Frame DIP Sensor
Optical/Electrical Characteristics (at Tc = 5°C to 45°C):
VCSEL Die Source Marking
V = A,V
Min
V = C
Min
Parameter
Symbol
Typ
Max
Typ
Max
Units
nm
Notes
Peak Wavelength
λ
832
865
832
865
Maximum Radiant LOPmax
Power
4.5
4.0
mW
Maximum output power
under any condition. This
is not a recommended
operating condition and
does not meet eye safety
requirements.
Wavelength
Temperature coef-
ficient
dλ/dT
dλ/dI
0.065
0.065
nm/ºC
Wavelength
Current coefficient
0.21
15
0.3
16
nm/mA
deg
Beam Divergence
θFW@1/
e^2
Threshold current Ith
4.2
0.4
2.1
3.0
mA
W/A
V
Slope Efficiency
Forward Voltage
Comments:
SE
VF
0.35
2.1
2.4
2.4
At 500uW output power
1. VCSELs are sorted into bins as specified in the power adjustment procedure. Appropriate binning register data values are used in the application
circuit to achieve the target output power. The VCSEL binning is marked on the integrated molded lead-frame DIP sensor package.
2. When driven with current or temperature range greater than specified in the power adjustment procedure section, eye safety limits may be
exceeded. The VCSEL should then be treated as a Class IIIb laser and as a potential eye hazard.
3. Over driving beyond LOP
process.
limit will cause the VSCEL to enter into on unstable region. Any LOP reference point in the laser power calibration
max
Sensor
Lens
Lens to Surface 2.40
Navigation Surface
Figure 8. Distance from lens reference plane to surface, Z
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PixArt Imaging Inc.
E-mail: fae_service@pixart.com.tw
10
PIXART [ PIXART IMAGING INC. ]
