PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Assembly Recommendation
7. Optional: The lens can be permanently locked to the
sensor package by melting the lens’ guide posts over
the sensor with heat staking process.
1. Insert the integrated molded lead-frame DIP
sensor and all other electrical components into the
application PCB.
8. Tune the laser output power from the VCSEL to meet
the Eye Safe Class I Standard as detailed in the LASER
Power Adjustment Procedure.
2. This sensor package is only qualified for wave-solder
process.
3. Wave-solder the entire assembly in a no-wash solder
process utilizing a solder fixture. The solder fixture
is needed to protect the sensor during the solder
process. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
9. Install the mouse top case. There must be a feature in
the top case (or other area) to press down onto the
sensor to ensure the sensor and lenses are interlocked
to the correct vertical height.
Design considerations for improving ESD Performance
4. Place the lens onto the base plate. Care must be taken
to avoid contamination on the optical surfaces.
For improved electrostatic discharge performance,
typical creepage and clearance distance are shown in
the table below. Assumption: base plate construction as
per the PixArt supplied IGES file and ADNS-6150, ADNS-
6160-001 or ADNS-6170-002 lens:
5. Remove the protective kapton tapes from the optical
aperture of the sensor and VCSEL respectively. Care
must be taken to keep contaminants from entering
the aperture.
Lens
ADNS-6150
12.0 mm
2.1 mm
ADNS-6160-001 ADNS-6170-002
6. Insert the PCB assembly over the lens onto the base
plate. The sensor package should self-align to the lens.
The optical position reference for the PCB is set by the
base plate and lens. The alignment guide post of the
lens locks the lens and integrated molded lead-frame
DIP sensor together. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
Creepage
Clearance
13.50 mm
1.28 mm
20.30 mm
1.28 mm
Note that the lens material is polycarbonate and
therefore, cyanoacrylate based adhesives or other
adhesives that may damage the lens should NOT be
used.
Lens interference 2.31
3.18
0.125
14.18
0.558
0.091
(2.78)
7X 1.78
0.070
0.110
Pin #1
0
0
Pad ring
∅ 1.10
0.043
0.89
0.035
Optical center
13.35
0.526
∅ 0.70
0.028
16X
Figure 5. Recommended PCB mechanical cutouts and spacing
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PixArt Imaging Inc.
E-mail: fae_service@pixart.com.tw
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PIXART [ PIXART IMAGING INC. ]
