Philips Semiconductors
Product specification
LIN transceiver
TJA1020
BONDING PAD LOCATIONS
handbook, full pagewidth
1
2
8
7
y
x
3
6
5A 5B 5C
4
0
MGW322
0
Fig.10 Bonding pad locations.
Table 2 Bonding pad locations (dimensions in µm). All x and y co-ordinates are referenced to the bottom left hand
corner of the die.
CO-ORDINATES
SYMBOL
PAD
x
y
RXD
1
2
111
1570
1395
424
134
90
NSLP
NWAKE
TXD
111
3
165
4
134
GND1
GND2
GND3
LIN
5A
5B
5C
6
1075
1185
1295
1318
1235
1125
90
90
419
1133
1490
BAT
7
INH
8
2002 Jul 17
17