Philips Semiconductors
Product specification
STARplugTM
TEA152x family
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
note 1
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
TEA152xP
TEA152xT
in free air
in free air
in free air
100
91
K/W
K/W
K/W
TEA152xAJM
65
Note
1. Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the
printed-circuit board. See the TEA152x application notes for details.
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611 part E”.
CHARACTERISTICS
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing
into the IC; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
ICC(operate)
ICC(startup)
Idrain
supply current
start-up supply current
normal operation
start-up
−
1.3
180
1.5
30
1.9
400
2
mA
µA
mA
µA
mA
V
−
supply current drawn from DRAIN no auxiliary supply; Vdrain > 60 V
pin
−
with auxiliary supply; Vdrain > 60 V
−
125
−3
ICC(ch)
VCC pin charging current
VCC start voltage
Vdrain > 60 V
−6
9
−4
VCC(start)
VCC(stop)
9.5
7.5
10
VCC stop voltage (under voltage
lock-out)
7.0
8.0
V
Pulse width modulator
δmin
minimum duty factor
−
−
0
−
−
%
%
δmax
maximum duty factor
f = 100 kHz
75
SOPS
Vdemag
demagnetization recognition
voltage level
50
100
1.5
150
2.0
mV
tsuppr
suppression of transformer ringing
at start of secondary stroke
1.0
µs
RC oscillator
VRC(min)
minimum voltage of RC oscillator
setting
60
75
90
mV
V
VRC(max)
maximum voltage of RC oscillator
setting
2.4
2.5
2.6
tRC(ch)
fosc
RC charging time
−
1
−
µs
frequency range of oscillator
10
100
200
kHz
2000 Sep 08
10
NXP [ NXP ]
