Philips Semiconductors
Product specification
Octuple 6-bit DACs with
THERMAL CHARACTERISTICS
SYMBOL
R
th(j-a)
TDA8444
TDA8444T
TDA8444AT
Note
I
2
C-bus
TDA8444; TDA8444T;
TDA8444AT
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
in free air
VALUE
75
UNIT
K/W
K/W
K/W
note 1
note 1
100
85
1. When mounted on a Printed-Circuit Board (PCB).
CHARACTERISTICS
V
CC
= 12 V; T
amb
= 25
°C;
unless otherwise specified.
SYMBOL
Supply
V
CC
I
CC
P
V
rst
Pin V
MAX
V
i(VMAX)
I
i
input effective voltage
input current
V
MAX
= V
CC
V
MAX
= 1 V
Pins SDA and SCL
V
I
V
IL
V
IH
I
IL
I
IH
P
IN
SDA
V
OL
I
o(sink)
V
I
V
IL
V
IH
I
IL
I
IH
LOW-level output voltage
output sink current
I
L
= 3 mA
−
3
−
8
−
−
−
−15
−
0.4
−
V
mA
input voltage
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
V
SDA
= V
SCL
= 6 V
0
−
3.0
V
SDA
= V
SCL
=
−0.3
V
−
−
−
−
−
−
−
5.5
1.0
−
−10
±10
V
V
V
µA
µA
1
−
−
−
−
−
V
CC
−
2.0
10
10
V
µA
µA
supply voltage
supply current
power dissipation
power reset voltage
V
MAX
= V
CC
= 12 V;
data = 00H
4.5
12
−
1
12
14
170
−
13.2
19
250
4
V
mA
mW
V
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Address bits (A0 to A2)
input voltage
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
V
An
= V
EE
V
An
= V
CC
0
−
2.2
−10
−
V
CC
1.0
−
−
1
V
V
V
µA
µA
1999 Apr 29
7
PHILIPS [ NXP SEMICONDUCTORS ]
