Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D
1
A
2
q
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
e
2
b
e
Z
b
w
M
2
θ
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
A
max.
2
(1)
(1)
UNIT
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.
o
o
18.5
17.8
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
65
55
4.4 5.9
4.2 5.7
2.54 2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT111-1
1995 Feb 07
12
NXP [ NXP ]
