Philips Semiconductors
Product specification
Multimedia bridge, high performance
Scaler and PCI circuit (SPCI)
SAA7146A
12 PACKAGE OUTLINES
QFP160: plastic quad flat package;
160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height
SOT322-1
y
X
A
120
121
81
80
Z
E
e
A
2
H
A
E
E
A
(A )
3
1
θ
w M
p
L
p
b
L
pin 1 index
detail X
41
160
1
40
Z
w M
D
v M
A
b
p
e
D
B
H
v M
B
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.
8o
0o
0.40 3.70
0.25 3.15
0.40 0.23 28.1 28.1
0.25 0.13 27.9 27.9
32.2 32.2
31.6 31.6
1.1
0.7
1.5
1.1
1.5
1.1
mm
3.95
0.25
0.15 0.1
0.65
1.95
0.3
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-08-04
SOT322-1
MO112DD1
1998 Apr 09
140
NXP [ NXP ]
