NXP Semiconductors
PMBT3904VS
40 V, 200 mA NPN/NPN switching transistor
Table 6.
Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
T
j
T
amb
T
stg
[1]
[2]
Parameter
junction temperature
ambient temperature
storage temperature
Conditions
Min
-
−55
−65
Max
150
+150
+150
Unit
°C
°C
°C
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
400
P
tot
(mW)
300
006aab604
200
100
0
−75
−25
25
75
125
175
T
amb
(°C)
FR4 PCB, standard footprint
Fig 1.
Per device: Power derating curve
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
R
th(j-sp)
Per device
R
th(j-a)
[1]
[2]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
in free air
Conditions
in free air
Min
-
-
Typ
-
-
Max
521
100
Unit
K/W
K/W
Per transistor
-
-
347
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
PMBT3904VS_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 8 July 2009
3 of 11
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