PESDxS1UL series
NXP Semiconductors
Unidirectional ESD protection diodes
11. Soldering
1.3
0.7
R0.05 (8×)
solder lands
solder resist
0.6 0.7 0.8
(2×) (2×) (2×)
0.9
solder paste
occupied area
0.3
(2×)
Dimensions in mm
0.4
(2×)
0.5
sod882_fr
(2×)
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint SOD882
PESDXS1UL_SER
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 25 October 2011
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