Philips Semiconductors
Product specification
I
2
C-bus controller
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.8.1
6.8.1.1
6.8.1.2
6.8.1.3
6.8.1.4
6.8.1.5
6.8.1.6
6.8.2
6.8.2.1
6.8.2.2
6.8.2.3
6.8.2.4
6.8.2.5
6.8.2.6
6.8.2.7
6.9
6.10
6.11
6.11.1
6.11.2
6.12
6.12.1
6.12.2
6.12.3
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Interface Mode Control (IMC)
Set-up registers S0', S2 and S3
Own address register S0'
Clock register S2
Interrupt vector S3
Data shift register/read buffer S0
Control/status register S1
Register S1 control section
PIN (Pending Interrupt Not)
ESO (Enable Serial Output)
ES1 and ES2
ENI
STA and STO
ACK
Register S1 status section
PIN bit
STS
BER
LRB/AD0
AAS
LAB
BB
Multi-master operation
Reset
Comparison to the MAB8400 I
2
C-bus interface
Deleted functions
added functions
Special function modes
Strobe
Long-distance mode
Monitor mode
7
7.1
7.2
8
9
10
11
12
13
14
14.1
15
16
16.1
16.2
16.2.1
16.2.2
16.3
16.3.1
16.3.2
16.3.3
17
18
PCF8584
SOFTWARE FLOWCHART EXAMPLES
Initialization
Implementation
I
2
C-BUS TIMING DIAGRAMS
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
2
C-BUS TIMING SPECIFICATIONS
PARALLEL INTERFACE TIMING
APPLICATION INFORMATION
Application Notes
PACKAGE OUTLINES
SOLDERING
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO
Reflow soldering
Wave soldering
Repairing soldered joints
DEFINITIONS
LIFE SUPPORT APPLICATIONS
19 PURCHASE OF PHILIPS I
2
C COMPONENTS
1997 Oct 21
2
PHILIPS [ NXP SEMICONDUCTORS ]
