Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I
2
C-bus
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
8
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
13.3.1
13.3.2
13.3.3
14
15
16
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
CHARACTERISTICS OF THE I
2
C-BUS
Bit transfer
Start and stop conditions
System configuration
Acknowledge
FUNCTIONAL DESCRIPTION
Addressing
Interrupt
Quasi-bidirectional I/Os
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
2
C-BUS TIMING CHARACTERISTICS
PACKAGE OUTLINES
SOLDERING
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO and SSOP
Reflow soldering
Wave soldering
Repairing soldered joints
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
PCF8574
1997 Apr 02
2
PHILIPS [ NXP SEMICONDUCTORS ]
