P82B715
NXP Semiconductors
I2C-bus extender
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
18
19
Contact information . . . . . . . . . . . . . . . . . . . . 22
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
4
4.1
5
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Sx, Sy: I2C-bus SDA or SCL. . . . . . . . . . . . . . . 4
Lx, Ly: buffered bus LDA or LCL. . . . . . . . . . . . 5
7.1
7.2
7.3
VCC, GND: positive and negative supply pins. . 5
8
8.1
8.1.1
8.1.2
8.2
Application design-in information . . . . . . . . . . 5
I2C-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 6
Pull-up resistance calculation . . . . . . . . . . . . . . 6
Calculating static bus drive currents. . . . . . . . . 7
Quick design-in point-to-point/multi-point
circuit information for 5 V bus . . . . . . . . . . . . . 10
Comparison of P82B715 versus P82B96
8.3
in the quick design-in point-to-point/
multi-point circuit. . . . . . . . . . . . . . . . . . . . . . . 11
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
Test information. . . . . . . . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
10
11
12
13
Soldering of SMD packages . . . . . . . . . . . . . . 17
Introduction to soldering . . . . . . . . . . . . . . . . . 17
Wave and reflow soldering . . . . . . . . . . . . . . . 17
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18
13.1
13.2
13.3
13.4
14
14.1
Soldering of through-hole mount packages . 19
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering by dipping or by solder wave . . . . . 19
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 19
Package related soldering information . . . . . . 20
14.2
14.3
14.4
15
16
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17.1
17.2
17.3
17.4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 November 2009
Document identifier: P82B715_8
NXP [ NXP ]
