P82B715
NXP Semiconductors
I2C-bus extender
14.4 Package related soldering information
Table 8.
Suitability of through-hole mount IC packages for dipping and wave soldering
Soldering method
Package
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
15. Abbreviations
Table 9.
Acronym
Abbreviations
Description
AdvancedTCA
CMOS
DDC
Advanced Telecom Computing Architecture
Complementary Metal-Oxide Semiconductor
Data Display Channel
EMI
ElectroMagnetic Interference
ElectroStatic Discharge
Field Replaceable Unit
ESD
FRU
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
Input/Output
I/O
IC
Integrated Circuit
IPMB
MM
Intelligent Platform Management Bus
Machine Model
PMBus
RC
Power Management Bus
Resistor-Capacitor network
Shelf Management Module
System Management Bus
Transistor-Transistor Logic
ShMM
SMBus
TTL
P82B715_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 9 November 2009
20 of 23
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