NTAG213F/216F
NXP Semiconductors
NFC Forum T2T IC with 144/888 bytes user memory and field detection
13. Package outline
HXSON4: plastic thermal enhanced extremely thin small outline package; no leads;
4 terminals; body 2.0 x 1.5 x 0.5 mm
SOT1312-1
X
D
B
A
E
A
3
A
A
1
detail X
terminal 1
index area
e
C
terminal 1
index area
v
C A
C
B
b
y
y
w
C
1
1
2
L
K
E
h
4
3
D
h
0
2 mm
v
scale
Dimensions: (mm are the orginal dimensons)
Unit
max 0.50 0.05 0.152 0.30 1.60 1.05 2.10 0.85
A
A
1
A
3
b
D
D
h
E
E
h
e
K
L
w
y
y
1
0.40
mm nom
min
0.25 1.50 1.00 2.00 0.80 0.5
0.00 0.050 0.20 1.40 0.95 1.90 0.75
0.35 0.1 0.05 0.05 0.05
0.20 0.30
Note
1. Plastic or metal protrusions af 0.075 maximum per side are not included.
sot1312-1_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
11-07-14
11-11-21
SOT1312-1
Fig 23. Package outline SOT1312AB2 (HXSON4)
NTAG213F_216F
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.1 — 28 August 2013
262231
49 of 56
NXP [ NXP ]
