NXP Semiconductors
BCP56; BCX56; BC56PA
80 V, 1 A NPN medium power transistors
2. Pinning information
Table 3.
Pin
SOT223
1
2
3
4
base
collector
emitter
collector
1
2
3
3
sym016
Pinning
Description
Simplified outline
Graphic symbol
4
1
2, 4
SOT89
1
2
3
emitter
collector
base
3
2
1
3
1
sym042
2
SOT1061
1
2
3
base
emitter
collector
3
1
2
1
2
sym021
3
Transparent top view
3. Ordering information
Table 4.
Ordering information
Package
Name
BCP56
BCX56
BC56PA
[1]
Type number
Description
plastic surface-mounted package with increased
heatsink; 4 leads
plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
Version
SOT223
SOT89
SOT1061
SC-73
SC-62
HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2
2
0.65 mm
Valid for all available selection groups.
BCP56_BCX56_BC56PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 25 October 2011
2 of 22
PHILIPS [ NXP SEMICONDUCTORS ]
