NXP Semiconductors
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BCP69
Conditions
in free air
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
192
125
93
250
132
93
298
151
114
154
76
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
BC869
BC69PA
R
th(j-sp)
thermal resistance from
junction to solder point
BCP69
BC869
BC69PA
-
-
-
-
-
-
16
16
20
K/W
K/W
K/W
[1]
[2]
[3]
[4]
[5]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
2
.
BCP69_BC869_BC69PA
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 12 October 2011
6 of 24
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