NXP Semiconductors
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
SOT23
SOT323
SOT416
SOT883
SOT54
T
j
T
amb
T
stg
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
single pulse;
t
p
≤
1 ms
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
Min
-
-
-
-
-
-
Max
50
45
6
100
200
100
Unit
V
V
V
mA
mA
mA
-
-
-
-
-
-
−65
−65
250
200
150
250
500
150
+150
+150
mW
mW
mW
mW
mW
°C
°C
°C
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT23
SOT323
SOT416
SOT883
SOT54
[1]
[2]
[3]
Conditions
in free air
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
500
625
833
500
250
K/W
K/W
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
BC847_BC547_SER_7
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 10 December 2008
5 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
