NXP Semiconductors
BC847 series
45 V, 100 mA NPN general-purpose transistors
10. Soldering
3.3
2.9
1.9
solder lands
solder resist
3
1.7
2
solder paste
0.6
(3×)
occupied area
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
0.7
(3×)
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
2.2
1.2
(2×)
1.4
(2×)
solder lands
4.6
2.6
solder resist
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
BC847_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 20 August 2012
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