Philips Semiconductors
74HC273; 74HCT273
Octal D-type flip-flop with reset; positive-edge trigger
Table 1:
Quick reference data
…continued
GND = 0 V; T
amb
= 25
°
C; t
r
= t
f
= 6 ns.
Symbol Parameter
C
i
C
PD
input capacitance
power dissipation
capacitance
propagation delay CP to Qn
HIGH-to-LOW propagation
delay MR to Qn
maximum input clock
frequency
input capacitance
power dissipation
capacitance
per flip-flop; V
I
= GND
to (V
CC
−
1.5 V)
Conditions
per flip-flop; V
I
= GND
to V
CC
V
CC
= 5 V; C
L
= 15 pF
V
CC
= 5 V; C
L
= 15 pF
V
CC
= 5 V; C
L
= 15 pF
Min
-
-
Typ
3.5
20
Max
-
-
Unit
pF
pF
74HCT273
t
PHL
,
t
PLH
t
PHL
f
max
C
i
C
PD
-
-
-
-
-
15
20
36
3.5
23
-
-
-
-
-
ns
ns
MHz
pF
pF
[1]
C
PD
is used to determine the dynamic power dissipation (P
D
in
µW).
P
D
= C
PD
×
V
CC2
×
f
i
×
N +
∑(C
L
×
V
CC2
×
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in V;
N = number of inputs switching;
∑(C
L
×
V
CC2
×
f
o
) = sum of outputs.
4. Ordering information
Table 2:
Ordering information
Package
Temperature range Name
74HC273
74HC273N
74HC273D
74HC273DB
74HC273PW
74HC273BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
DIP20
SO20
SSOP20
TSSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic shrink small outline package; 20 leads; body width
5.3 mm
plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT146-1
SOT339-1
SOT360-1
SOT764-1
plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
Description
Version
Type number
DHVQFN20 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
DIP20
SO20
plastic dual in-line package; 20 leads (300 mil)
74HCT273
74HCT273N
74HCT273D
−40 °C
to +125
°C
−40 °C
to +125
°C
SOT146-1
plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
74HC_HCT273_3
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 24 January 2006
2 of 26
PHILIPS [ NXP SEMICONDUCTORS ]
