NXP Semiconductors
74HC573-Q100; 74HCT573-Q100
Octal D-type transparent latch; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
pin 1 index
A
1
(A
3
)
A
θ
L
p
L
1
e
b
p
10
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
MO-153
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
A
max.
1.1
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
6.6
6.4
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.5
0.2
θ
8
o
o
0
Fig 14. Package outline SOT360-1 (TSSOP20)
74HC_HCT573_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 3 — 5 March 2013
15 of 20
PHILIPS [ NXP SEMICONDUCTORS ]
