NXP Semiconductors
74HC32; 74HCT32
Quad 2-input OR gate
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
D
B
A
A
A1
E
c
terminal 1
index area
detail X
terminal 1
index area
e
2
L
e1
b
6
v
M
C A B
w
M
C
y1 C
C
y
1
Eh
14
7
e
8
13
Dh
0
9
X
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
(1)
max.
1
A1
0.05
0.00
b
0.30
0.18
c
0.2
D
(1)
3.1
2.9
Dh
1.65
1.35
E
(1)
2.6
2.4
Eh
1.15
0.85
e
0.5
e1
2
L
0.5
0.3
v
0.1
w
0.05
y
0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
SOT762-1
REFERENCES
IEC
---
JEDEC
MO-241
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 12. Package outline SOT762-1 (DHVQFN14)
74HC_HCT32
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 4 September 2012
13 of 17
PHILIPS [ NXP SEMICONDUCTORS ]
