74HC164; 74HCT164
Philips Semiconductors
8-bit serial-in, parallel-out shift register
Table 1:
Quick reference data …continued
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.
Symbol
Parameter
maximum clock frequency CL = 15 pF;
CC = 5 V
Conditions
Min
Typ
Max
Unit
fmax
-
78
-
MHz
V
CI
input capacitance
-
-
3.5
40
-
-
pF
pF
[1]
[2]
CPD
power dissipation
capacitance per package
Type 74HCT164
tPHL, tPLH
propagation delay
CP to Qn
CL = 15 pF;
CC = 5 V
-
-
-
14
16
61
-
-
-
ns
V
MR to Qn
CL = 15 pF;
CC = 5 V
ns
V
fmax
maximum clock frequency CL = 15 pF;
CC = 5 V
MHz
V
CI
input capacitance
-
-
3.5
40
-
-
pF
pF
[1]
[3]
CPD
power dissipation
capacitance per package
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz
fo = output frequency in MHz
N = number of inputs switching
∑ (CL × VCC2 × fo) = sum of outputs
CL = output load capacitance in pF
VCC = supply voltage in Volts
[2] For HC the condition is VI = GND to VCC
.
[3] For HCT the condition is VI = GND to VCC − 1.5 V.
4. Ordering information
Table 2:
Ordering information
Type number
Package
Temperature
range
Name
Description
plastic dual in-line package; 14 leads (300 mil)
Version
74HC164N
74HC164D
−40 °C to +125 °C DIP14
−40 °C to +125 °C SO14
SOT27-1
plastic small outline package; 14 leads; body width
3.9 mm; body thickness 1.47 mm
SOT108-2
74HC164DB
74HC164PW
−40 °C to +125 °C SSOP14
−40 °C to +125 °C TSSOP14
plastic shrink small outline package; 14 leads; body
width 5.3 mm
SOT337-1
plastic thin shrink small outline package; 14 leads; body SOT402-1
width 4.4 mm
74HCT164N
74HCT164D
−40 °C to +125 °C DIP14
−40 °C to +125 °C SO14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
plastic small outline package; 14 leads; body width
3.9 mm; body thickness 1.47 mm
SOT108-2
9397 750 14693
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 4 April 2005
2 of 24
NXP [ NXP ]
