Philips Semiconductors
Product specification
Quad 2-input AND gate
74HC08; 74HCT08
V
1A
1
handbook, halfpage
CC
14
handbook, halfpage
1A
1B
1
2
3
4
5
6
7
V
CC
14
13
12
11
10
9
1B
2
3
13 4B
12 4A
4B
4A
4Y
3B
3A
3Y
1Y
1Y
(1)
2A
2B
2Y
4
5
6
11 4Y
10 3B
GND
2A
08
2B
2Y
9
3A
8
GND
7
8
MNA220
GND 3Y
Top view
MCE183
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.1 Pin configuration DIP14, SO14 and
(T)SSOP14.
Fig.2 Pin configuration DHVQFN14.
1
2
handbook, halfpage
&
&
&
&
3
6
handbook, halfpage
1
2
1A
1B
1Y
2Y
3Y
3
6
8
4
5
4
5
2A
2B
9
3A
3B
9
10
8
10
12
13
4A
4B
4Y 11
12
13
MNA222
11
MNA223
Fig.3 Logic symbol.
Fig.4 IEC logic symbol.
2003 Jul 25
4
NXP [ NXP ]
