BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol Parameter
Per device
Conditions
Min
Typ
Max
Unit
[1]
Rth(j-a)
thermal resistance from
in free air
junction to ambient
SOT23
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
500
416
700
416
330
450
450
500
625
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
[2]
[2]
[2]
SOD323
[2]
[2]
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS70XY)
-
-
260
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Per diode
Conditions
Min
Typ
Max
Unit
[1]
VF
forward voltage
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
410
750
1
mV
mV
V
IF = 10 mA
IF = 15 mA
VR = 50 V
IR
reverse current
100
10
2
nA
μA
pF
VR = 70 V
Cd
diode capacitance
VR = 0 V; f = 1 MHz
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
6 of 20
NXP [ NXP ]
